- Investigation of Bonding Strength of Al Solid Phase Diffusion Bonded Joint
with Surface Treatment
Using Electrolyzed Water
Takuma Tanaka, Ikuo Shohji, Tatsuya Kobayashi, Hisashi Imai
Materials Science Forum, Vol. 1016, pp. 1466-1472 (2021) - Effect of Temperature and Humidity on Degradation Behavior of Cu/Epoxy
Interface under High
Temperature and High Humidity Aging
Riku Suzuki, Ikuo Shohji, Tatsuya Kobayashi, Yu Tonozuka
Materials Science Forum, Vol. 1016, pp. 1436-1442 (2021)
- Effect of Microstructure on Joint Strength of Fe/Al Resistance Spot Welding
for Multi-Material
Components
Koki Kumamoto, Ikuo Shohji, Tatsuya Kobayashi, Muneyoshi Iyota
Materials Science Forum, Vol. 1016, pp. 774-779 (2021)
- Fabrication of three-dimensional microstructure film by Ni-Cu alloy electrodeposition
for joining
dissimilar materials
Tatsuya Kobayashi, Ikuo Shohji
Materials Science Forum, Vol. 1016, pp. 738-743 (2021)
- Microstructure and Tensile Properties of Sn-Ag-Cu-In-Sb Solder
Yukihiko Hirai, Kouki Oomori, Hayato Morofushi, Ikuo Shohji
Materials Science Forum, Vol. 1016, pp. 553-560 (2021)
- Brazing of Stainless Steel Using Electrolytic Ni-P Plating Film and Investigation
of Corrosion Behavior
Anna Hashimoto, Shubin Liu, Ikuo Shohji, Tatsuya Kobayashi, Junichiro Hirohashi, Tsunehito Wake, Susumu Arai,
Yuichiro Kamakoshi
Materials Science Forum, Vol. 1016, pp. 522-527 (2021) - Fabrication of Porous Aluminum Alloy by Precursor Method Using Vertical
Type Twin-Roll Casting
Ryosuke Suzuki, Takumi Masubuchi, Shinichi Nishida, Ikuo Shoji, Yoshihiko Hangai, Hidetoshi Fujii
and Masaaki Matsubara
J.JFS, Vol.92, No.11, pp577-582 (2020) - Effect of Addition of Trace Ni and Ge into Sn-Sb-Ag High Temperature Lead-free
Solder Alloy
on its Mechanical Properties
Kohei MITSUI, Ikuo SHOHJI, Tatsuya KOBAYASHI and Hirohiko WATANABE
Journal of smart processing, Vol.9, No.3, pp.133-139 (2020)
- Corrosion Behavior of Nickel-based Brazing Filler Metal for Stainless Steel
Heat Exchanger
Yusuke FUKAI, Ikuo SHOHJI, Tatsuya KOBAYASHI, Tetsuya ANDO, Takuya YOSHIDA, Tsuyoshi KASHIWASE
and Noboru OTOMO
Journal of smart processing, Vol.9, No.3, pp.127-132 (2020) - Investigation of Degradation Behavior of Cohesion of Resin and Adhesion
Interface under High
Temperatureand High Humidity Conditions
Hitomi ABIKO, Ikuo SHOHJI, Tatsuya KOBAYASHI, Yugo TOMITA and Tatsunori MATSUNAGA
Journal of smart processing, Vol.9, No.2, pp.75-81 (2020) - Evaluation of Microstructures and Mechanical Properties of Sn-10Sb-Ni Lead-Free
Solder Alloys with
Small Amount of Ni Using Miniature Size Specimens
Tatsuya Kobayashi, Ikuo Shohji
Metals 2019, Volume 9, Issue 12, 1348 (2019) - Erosion Resistance Properties of Iron–Carbon Composite Plating to Molten
Lead-Free Solder
Jun Watanabe, Kenji Hatsuzawa, Shigeyuki Ogata, Shinichi Yoshida and Ikuo Shohji
Applied Sciences, 9(13), 2724 (2019) - Effect of Bi addition on Tensile Properties of Sn-Ag-Cu Solder at Low Temperature
Yukihiko Hirai, Kouki Oomori, Hayato Morofushi, Ikuo Shohji
Materials Transactions, Vol.60, No.6, pp.909-914 (2019)
- Effects of Ni Addition to Sn-5Sb High-Temperature Lead-Free Solder on Its
Microstructure and
Mechanical Properties
Tatsuya Kobayashi, Kohei Mitsui and Ikuo Shohji
Materials Transactions, Vol.60, No.6, pp.888-894 (2019) - Robustness Improvement of Thermosonic Flip Chip Bonding to Device Chip
Tilt
Taizo Tomioka, Tomohiro Iguchi and Ikuo Shohji
Journal of Japan Society for Technology of Plasticity, Vol.60, No.700, pp.142-146 (2019) - Bondability Investigations of Thermosonic Flip Chip Bonding using Ultrasonic
Vibration Perpendicular
to the Interface
Taizo Tomioka, Ikuo Shohji
Transactions of the Japan Institute of Electronics Packaging, Vol.12, E18-013, 7 pages (2019) - Micro-Brazing of Stainless Steel Using Ni-P Alloy Plating
Shubin Liu, Ikuo Shohji, Makoto Iioka, Anna Hashimoto, Junichiro Hirohashi, Tsunehito Wake and Susumu Arai
Applied Sciences, 9(6),1094 (2019) - A Study on Reliability of Pillar-Shaped Intermetallic Compounds Dispersed
Lead-Free Solder Joint
Yusuke Nakata, Motoki Kurasawa, Tomihito Hashimoto, Kenji Miki and Ikuo Shohji
Materials Science Forum, Vol. 941, pp.2087-2092 (2018) - Tensile and Fatigue Properties of Miniature Size Specimen of Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge
Lead-Free
Solder
Masaki Yokoi, Tatsuya Kobayashi and Ikuo Shohji
Materials Science Forum, Vol. 941, pp.2081-2086 (2018) - Effect of Cooling Rate on Intermetallic Compounds Formation in Sn-Ag-Cu-In
Solder
Kenji Miki, Tatsuya Kobayashi, Ikuo Shohji and Yusuke Nakata
Materials Science Forum, Vol. 941, pp.2075-2080 (2018)
- Investigation of Crack Initiation in Glass Substrate by Residual Stress
Analysis
Amon Shinohara, Tatsuya Kobayashi, Ikuo Shohji and Yuki Umemura
Materials Science Forum, Vol. 941, pp.2069-2074 (2018) - Plastic Deformation Simulation of Sintered Ferrous Material in Cold-Forging
Process
Yuki Morokuma, Shinichi Nishida, Yuichiro Kamakoshi, Koshi Kanbe, Tatsuya Kobayashi and Ikuo Shohji
Materials Science Forum, Vol. 941, pp.552-557 (2018) - Microstructures and Mechanical Properties of Welded Joints of Several High
Tensile Strength Steel
Takahiro Izumi, Tatsuya Kobayashi, Ikuo Shohji and Hiroaki Miyanaga
Materials Science Forum, Vol. 941, pp.224-229 (2018) - Optimization of Sintering, Cold-forging and Carburizing Processes to ImproveToughness and Fatigue
Strength of Sintered Mo-Alloyed Steel
Yuichiroh Kamakoshi, Ikuo Shohji, Noriko Inoue and Shunji Fukuda
Journal of smart processing, Vol.7, No.6, pp.251-259 (2018) - Fabrication of Aluminum Foam by Casting Precursor Method
Ryosuke Suzuki, Takuma Nishimoto, Yoshihiko Hangai, Ikuo Shoji and Masaaki Matsubara
Journal of The Japan Institute of Metals and Materials, Vol.82, No.9, pp.349-357（2018） - Evaluation of Deterioration Life of Interface of Copper and Epoxy Resin
under High Temperature and
High Humidity Conditions
Yu Tonozuka, Tatsuya Kobayashi, Ikuo Shohji, Hiroaki Hokazono, Kuniaki Takahashi and Toku Ezure
Journal of smart processing, Vol.7, No.4, pp.128-134 (2018） - Comparison of Sn-5Sb and Sn-10Sb Alloys in Tensile and Fatigue Properties
Using Miniature Size
Specimens
Tatsuya Kobayashi, Kyosuke Kobayashi, Kohei Mitsui, and Ikuo Shohji
Advances in Materials Science and Engineering, Volume 2018, Article ID 1416942 (2018) - Effect of Power Cycling and Heat Aging on Reliability and IMC Growth of
Sn-5Sb and Sn-10Sb Solder
Joints
Tatsuya Kobayashi, Ikuo Shohji, and Yusuke Nakata
Advances in Materials Science and Engineering, Volume 2018, Article ID 4829508 (2018) - Comparison of Sn-Sb and Sn-Ag-Cu-Ni-Ge Alloys Using Tensile Properties
of Miniature Size Specimens
Tatsuya Kobayashi, Masaki Yokoi, Kyosuke Kobayashi, Kohei Mitsui, and Ikuo Shohji
Solid State Phenomena, Vol. 273, pp.83-90 (2018) - Effect of bond force profile on bondability of thermosonic flip chip bonding
Taizo Tomioka, Tomohiro Iguchi and Ikuo Shohji
Quarterly Journal of the Japan Welding Society, Vol.36, No.1, pp.16-20（2018） - Formation mechanism of pillar-shaped intermetallic compounds dispersed
lead-free solder joint
Y Nakata, T Hashimoto, M Kurasawa, Y Hayashi, and I Shohji
IOP Conf. Series: Materials Science and Engineering 257 (2017) 012014 - Finite element method analysis of cold forging for deformation and densification
of Mo alloyed sintered
steel
Y Kamakoshi, S Nishida, K Kanbe and I Shohji
IOP Conf. Series: Materials Science and Engineering 257 (2017) 012012
- Improvement of mechanical strength of sintered Mo alloyed steel by optimization
of sintering
and cold-forging processes with densification
Y Kamakoshi, I Shohji, Y Inoue and S Fukuda
IOP Conf. Series: Materials Science and Engineering 257 (2017) 012011 - The effect of boriding on wear resistance of cold work tool steel
Y. Anzawa, S. Koyama and I. Shohji
Journal of Physics: Conf. Series 843 (2017) 012064 - Liquid phase diffusion bonding of A1070 by using metal formate coated Zn
sheet
K. Ozawa, S. Koyama and I. Shohji
Journal of Physics: Conf. Series 843 (2017) 012005 - Liquid Phase Diffusion Bonding of Aluminum Casting Alloy by Using Metal
Salt Coated Zn Sheet
Shunya SAIJO, Shinji KOYAMA and Ikuo SHOHJI
Journal of smart processing, Vol.6, No.5, pp.195-199 (2017)
- Effect of Rust Inhibitor in Brine on Corrosion Properties of Copper
Kazunari Higuchi, Ikuo Shohji, Tetsuya Ando, Shinji Koyama, Yoshikazu Mizutani, Yukio Inoue
Procedia Engineering 184, pp.743–749 (2017) - Change of Crystallographic Orientation Characteristics of (001)-Oriented
Electrodeposited Silver Films
during Self-Annealing at Room Temperature
Yumi Hayashi, Ikuo Shohji, Hiroshi Miyazawa
Procedia Engineering 184, pp.725–731 (2017) - Degradation Behaviors of Adhesion Strength between Epoxy Resin and Copper
under Aging at High
Temperature
Yu Tonozuka, Ikuo Shohji, Shinji Koyama, Hiroaki Hokazono
Procedia Engineering 184, pp.648–654 (2017) - Liquid Phase Diffusion Bonding of AC2C/ADC12 Aluminum Casting Alloy by
Using Metal Salt Coated
Zn Sheet
Shunya Saijo, Shinji Koyama, Ikuo Shohji
Procedia Engineering 184, pp.284-289 (2017) - Fracture Behaviors of Miniature Size Specimens of Sn-5Sb Lead-Free Solder
under Tensile and Fatigue
Conditions
Kyosuke Kobayashi, Ikuo Shohji, Shinji Koyama, Hiroaki Hokazono
Procedia Engineering 184, pp.238–245 (2017) - Degradation Behaviors of Adhesion Strength of Structural Adhesive for Weld-Bonding
under High
Temperatureand Humidity Conditions
Yugo Tomita, Ikuo Shohji, Shinji Koyama, Seigo Shimizu
Procedia Engineering 184, pp.231–237 (2017) - Bonding Characteristics of Sn-57Bi-1Ag Low-Temperature Lead-Free Solder
to Gold-Plated Copper
Yuki Maruya, Hanae Hata, Ikuo Shohji, Shinji Koyama
Procedia Engineering 184, pp.223–230 (2017) - Effect of Bonding Time and Bonding Temperature on Lead-Free Solder Joints
Dispersed Pillar Shaped
IMCs
Yawara Hayashi, Yusuke Nakata, Ikuo Shohji, Shinji Koyama, Tomihito Hashimoto
Procedia Engineering 184, pp.214–222 (2017) - Tensile and Fatigue Properties of Miniature Size Specimens of Sn-5Sb Lead-Free
Solder
Kyosuke Kobayashi, Ikuo Shohji, Hiroaki Hokazono
Materials Science Forum, Vol. 879, pp.2377-2382 (2016) - Comparison of Self-Annealing Behaviors in (001)- and (111)-Oriented Electrodeposited
Silver Films by
In Situ EBSP Analysis
Yumi Hayashi, Ikuo Shohji, Hiroshi Miyazawa
Materials Science Forum, Vol. 879, pp.2243-2248 (2016) - Effect of Added Elements on Microstructures and Joint Strength ofLead-free
Sn-Based Solder Joint
Dispersed IMC Pillar
Yawara Hayashi, Ikuo Shohji, Yusuke Nakata, Tomihito Hashimoto
Materials Science Forum, Vol. 879, pp.2216-2221 (2016) - IMC Pillar Dispersed Lead-free Solder Joint
Yusuke Nakata, Tomihito Hashimoto, Yawara Hayashi and Ikuo Shohji
Journal of Smart Processing -for Materials, Environment & Energy-, Vol. 5, No. 5, pp. 309-314, (2016) - Microstructure and electrochemical corrosion behavior of Fe-Cr system alloys
as substitutes for Ni-based
brazing filler metal
K.D. Shi, T. Tsunoda, I. Shohji, K. Matsu and Y. Taguchi
Acta Metallurgica Sinica(English Letters), 29-8, pp.697-706, (2016) - Interfacial Reactions in Sn-57Bi-1Ag Solder Joints with Cu and Au Metallization
Hanae Hata, Yuuki Maruya and Ikuo Shohji
Materials Transactions, Vol. 57, No. 6, pp.887-891, (2016) - Effect of Strain Rate and Temperature on Tensile Properties of Bi-Based
Lead-Free Solder
Zhang Haidong, Ikuo Shohji, Masayoshi Shimoda and Hirohiko Watanabe
Materials Transactions, Vol. 57, No. 6, pp.873-880, (2016) - In Situ Observation of Self-Annealing Behaviors of (001)-Oriented Electrodeposited
Silver Film by EBSD
Method
Yumi Hayashi, Hiroshi Miyazawa, Kohei Minamitani and Ikuo Shohji
Materials Transactions, Vol. 57, No. 6, pp.815-818, (2016) - Effect of Interfacial Hardness on Failure Modes of Liquid Phase Diffusion
Bonded Sn/Sn with Bi Filler
Shinji Koyama, Issei Oya and Ikuo Shohji
Materials Transactions, Vol. 57, No. 6, pp.810-814, (2016) - Evaluation on Mechanical Properties of Sn-Bi-Ag Solder and Reliability
of the Solder Joint
Hanae Shimokawa, Tasao Soga, Koji Serizawa, Kaoru Katayama and Ikuo Shohji
Transactions of the Japan Institute of Electronics Packaging, Vol. 8, No.1, pp. 46-54 (2015) - Joint Strength of SUS304 Stainless Steel Joint Brazed with Fe-Cr System
Alloy
Kangdao Shi, Takahiro Tsunoda, Kazuomi Kusumoto, Ikuo Shohji, Kotaro Matsu and Yasuhiro Taguchi
Journal of Smart Processing - for Materials, Environment & Energy -, Vol. 4, No. 5, pp. 247-253 (2015) - Evaluation of Corrosion Resistance of SUS304 Stainless Steel Joint Brazed
with Fe-Cr System Alloy
Kangdao Shi, Takahiro Tsunoda, Kazuomi Kusumoto, Ikuo Shohji, Kotaro Matsu and Yasuhiro Taguchi
Journal of Smart Processing - for Materials, Environment & Energy -, Vol. 4, No. 4, pp. 215-221 (2015) - Cu/Cu Direct Bonding by Metal Salt Generation Bonding Technique with Organic
Acid and Its Persistence
of Reformed Layer
Shinji Koyama, Naoki Hagiwara and Ikuo Shohji
Japanese Journal of Applied Physics, 54, 030216 (2015)
- Effect of Filler Content and Coupling Agent on Mechanical Properties of
Underfill Material
Hironao Mitsugi, Shinya Kitagoh, Ikuo Shohji and Shinji Koyama
Transactions of the Japan Institute of Electronics Packaging, Vol. 7, pp. 25-31 (2014)
- Sn-W Structure Produced at the Interface Between Sn-3Ag-0.5Cu Solder and
Plating Metallization on
W Substrate
Chiko Yorita，Masahide Harada，Toru Nishikawa，Tatsuya Kobayashi and Ikuo Shohji
Journal of Smart Processing for Materials，Environment & Energy，Vol. 3, No. 4, pp. 232-239 (2014)
- Solid State Bonding of Al Alloy/SUS304 by Metal Salt Generation Bonding
Technique with Acetic Acid
Kota Matsubara, Shinji Koyama, Hideo Nagata, Yoshiyuki Suda and Ikuo Shohji
Advanced Materials Research, Vol. 922, pp. 491-496 (2014)
- Cu / Cu Direct Bonding by Metal Salt Generation Bonding Technique with
Formic Acid and Citric Acid
Naoki Hagiwara, Shinji Koyama and Ikuo Shohji
Advanced Materials Research, Vol. 922, pp. 219-223 (2014)
- Effect of Strain Rate on Tensile Properties of Miniature Size Specimens
of Several Lead-free Alloys
Ikuo Shohji and Yuichiro Toyama
Materials Science Forum, Vol. 783-786, pp. 2810-2815 (2014) - Effect of Se content in high-cyanide silver plating solution on {200} crystal
plane orientation ratio of
electrodeposited silver layer
Hiroshi Miyazawa, Masafumi Ogata, Keisuke Shinohara, Akira Sugawara and Ikuo Shohji
Materials Science Forum, Vol. 783-786, pp. 1458-1463 (2014) - Effect of Mechanical Properties of Joing Materials for Flip Chip on Thermo-mechanical
Stress at Wiring
Layer under Flip Chip Pad
Takashi Hisada, Ikuo Shohji, Yasuharu Yamada and Kozo Fujimoto
Journal of Smart Processing - for Materials, Enviromental & Energy-, Vol. 3, No. 1, pp. 47-53 (2014) - Effect of Se Content in High-Cyanide Silver Plating Solution on {200} Crystal
Plane Orientation Ratio of
Electrodeposited Silver Layer
Hiroshi Miyazawa, Masafumi Ogata, Keisuke Shinohara, Akira Sugawara and Ikuo Shohji
journal of Japan Research Institute for Advanced Copper-Base Materials and Technologies , Vol.53, No.1, pp.266-271 (2014)
- A Study of the Effect of Indium Filler Metal on the Bonding Strength of
Copper and Tin
Shinji Koyama, Seng Keat Ting, Yukinari Aoki and Ikuo Shohji
Transactions of the Japan Institute of Electronics Packaging, 6, pp. 93-98 (2013) - Effect of Surface Modification by Aqueous NaOH Solution on Bond Strength
of Solid-State Bonded
Interface of Al
Shinji Koyama, Ting Seng Keat, Shun Amari, Kouta Matsubara and Ikuo Shohji
Materials Transactions, 54, No.10, pp.1975-1980 (2013) - The Influence of Incorporated Additives in Lead-Free Electroless Nickel
Plating Film on the Reliability of
Solder Joint
Tetsuyuki Tsuchida, Toshikazu Okubo, Takahiro Kano and Ikuo Shohji
Journal of Japan Institute of Electronics Packaging, 16, [6], pp.484-491 (2013)
- Effect of Ge and P Addition in Sn-Ag-Cu-Ni Lead-Free Solder on the Solder
Joint Properties
Ikuo Shohji, Hirohiko Watanabe and Ryohei Arai
The IEICE Transactions on Electronics, Vol.J95-C No.11 pp.324-332 (2012)
- Study on Erosion Resistance Characteristics of Fe-MWCNT Composite Plating
against Lead-free Solder
J. Watanabe, N. Sekimori, K. Hatsuzawa, T. Uetani and I. Shohji
Journal of Physics: Conference Series, 379 (2012) 012025 - Influence of Processing Temperature on Boriding of SUS304 Stainless Steel
by B Added Fused Salt Bath
Shinji Koyama, Tatsuya Fukuda, Kentaro Kawasumi and Ikuo Shohji
J. Japan Inst. Metals, 75, [12], pp.684-689 (2011)
- Effect of B Contents in Fused Salt Bath on Boriding of SUS304 Stainless
Steel
Shinji Koyama, Masashi Takada, Kentaro Kawasumi, Tatsuya Fukuda and Ikuo Shohji
J. Japan Inst. Metals, 75, [12], pp.678-683 (2011)
- Influence of Processing Temperature on Boriding of SUS304 Stainless Steel
by Al Added Fused Salt Bath
Shinji Koyama, Kentaro Kawasumi, Tatsuya Fukuda and Ikuo Shohji
Journal of the Japan Society of Mechanical Engineers (Series A)，77，[783], pp.1986-1993 (2011)
- Development of Wettability Evaluation Equipment for Solder Paste Using
Laser Displacement Method
Ikuo Shohji, Shinji Koyama, Issei Oya, Toshihiro Isaka, Hironaga Miyamoto, Masashi Nishimuro and Kiyoshi Hiramoto
Journal of Japan Institute of Electronics Packaging, 14, [5], pp.390-393 (2011) - Dissolution Properties of Cu in Sn-Cu-Ni and Sn-Zn Lead-Free Alloys
Ikuo Shohji, Hirohiko Watanabe, Marie Nagai and Tsutomu Osawa
Journal of Japan Institute of Electronics Packaging, 14, [5], pp.382-389 (2011)
- Effect of Indium Filler Metal on Tensile Strength of Sn-Ni Bond Interface
Shinji Koyama, Toshihiro Isaka and Ikuo Shohji
Journal of Japan Institute of Electronics Packaging, 14, [5], pp.377-381 (2011)
- Effect of Interfacial Reaction on Joint Strength of Semiconductor Metallization
and Sn-3Ag-0.5Cu
Solder Ball
Chiko Yorita, Tatsuya Kobayashi and Ikuo Shohji
Key Engineering Materials, 462-463, pp.849-854 (2011)
- Effect of Interfacial Reaction in Sn-Ag-Cu Solder Alloy with Ni addition
Hirohiko Watanabe, Masayoshi Shimoda, Noboru Hidaka and Ikuo Shohji
Key Engineering Materials, 462-463, pp.247-252 (2011)
- Effect of Ag Content on Mechanical Properties of Lead-free Sn-Ag-Cu-Ni-Ge
Alloy
Ikuo Shohji, Ryohei Arai, Hisao Ishikawa and Masao Kojima
Key Engineering Materials, 462-463, pp.82-87 (2011)
- Analysis of Stress-strain Hysteresis Loop and Prediction of Thermal Fatigue
Life for Chip Size Package
Solder Joints
Ikuo Shohji, Tatsuya Kobayashi and Tomotake Tohei
Key Engineering Materials, 462-463, pp.76-81 (2011)
- Effect of Ni Content on Dissolution Properties of Cu in Molten Sn-Ag-Cu-Ni-Ge
Alloy
Hirohiko Watanabe, Marie Nagai, Tsutomu Osawa and Ikuo Shohji
Key Engineering Materials, 462-463, pp.70-75 (2011)
- Cu-Sn-Zr-P Alloy for High-Strength Heat Exchanger Tube
Tetsuya Ando, Hirokazu Tamagawa and Ikuo Shohji
Transactions of the Japan Institute of Electronics Packaging, 3, pp.14-17 (2010)
- Effect of Formic Acid Surface Modification on Bond Strength of Solid-State
bonded Interface of Tin and
Copper
Shinji Koyama, Yukinari Aoki and Ikuo Shohji
Materials Transactions, 51, No.10, pp.1759-1763 (2010)
- Fluxless Bonding of Ni-P/Cu Plated Al Alloy and Cu Alloy with Lead-free
Sn-Cu Foil
Ikuo Shohji, Shinji Koyama, Itaru Oshiro, Hideaki Nara and Yoshiharu Iwata
Materials Transactions, 51, No.10, pp.1753-1758 (2010)
- Boron Particle Composite Plating with Ni-B Alloy Matrix
Susumu Arai, S Kasai and Ikuo Shohji
Journal of The Electrochemical Society, 157, pp.D119-D125 (2010)
- Comparison of Erosion Rates of SUS304 and SUS316 Stainless Steels by Molten
Sn-3Ag-0.5Cu Solder
Ikuo Shohji, Kazuhito Sumiyoshi and Makoto Miyazaki
Transactions of the Japan Institute of Electronics Packaging, 2, pp.35-39(2009)
- Effect of Impurities of Au and Pd on Tensile Properties of Eutectic Sn-Pb
Solder for Aerospace
Application
Ikuo Shohji, Yuta Saitoh, Norio Nemoto, Tsuyoshi Nakagawa, Nobuaki Ebihara and Fusao Iwase
Transactions of the Japan Institute of Electronics Packaging, 2, pp.29-34(2009)
- Phosphorus Particle Composite Plating with Ni-P Alloy Matrix
Yosuke Suzuki, Susumu Arai, Ikuo Shohji and Eiji Kobayashi
Journal of The Electrochemical Society, 156, pp.D283-D286 (2009)
- Effect of Shear Speed on Ball Shear Strength of Sn-3Ag-0.5Cu Solder Ball
Joint
Ikuo Shohji, Satoshi Shimoyama, Hisao Ishikawa and Masao Kojima
Transactions of the Japan Institute of Electronics Packaging, 1, pp.9-14 (2008)
- Impact Properties of Sn-0.75Cu Lead-free Solder Ball Joint
Ikuo Shohji, Tsutomu Osawa, Takeshi Okashita and Hirohiko Watanabe
Key Engineering Materials, Vol.385-387, pp.745-748 (2008)
- Effect of Thermal Cycle Conditions on Thermal Fatigue Life of Chip Size
Package Solder Joint
Ikuo Shohji, Tomotake Tohei, Keisuke Yoshizawa, Masaharu Nishimoto, Yasushi Ogawa and Takayuki Kawano
Key Engineering Materials, Vol.385-387, pp.433-436 (2008)
- Comparison of Impact Properties of Sn-9Zn and Sn-3Ag-0.5Cu Lead-free Solder
Ball Joints
Ikuo Shohji, Satoshi Shimoyama, Hisao Ishikawa and Masao Kojima
Key Engineering Materials, Vol.385-387, pp.429-432 (2008)
- Impact Reliability of Lead-free Sn-Ag-Cu-Ni-Ge Solder Joint with Cu Electrode
Ikuo Shohji, Hirohiko Watanabe, Takeshi Okashita and Tsutomu Osawa
Materials Transactions, Vol.49, pp.1513-1517 (2008)
- Electrodeposition of Ni-P Composite Films Using Watts Base Bath Containing
Phosphorous Particles
Yosuke Suzuki, Susumu Arai, Ikuo Shohji and Eiji Kobayashi
Journal of The Surface Finishing Society of Japan, Vol.59, No.5, pp.343-345 (2008)
- Effect of Underfill Materials on Thermal Fatigue Lives of Chip Size Package
Solder Joints
Ikuo Shohji, Tomotake Tohei, Keisuke Yoshizawa, Masaharu Nishimoto, Yasushi Ogawa and Takayuki Kawano
Smart Processing Technology, Vol.2, pp.111-114 (2008)
- Growth Kinetics of Interfacial Reactions and Ball Shear Strength of Sn-9Zn
Solder Joints on Electroless
Ni/Au Plated Electrodes
Ikuo Shohji, Satoshi Shimoyama, Hisao Ishikawa and Masao Kojima
Smart Processing Technology, Vol.2, pp.103-106(2008)
- Effect of Aging on Tensile Properties of Low-Melting Lead-Free Solders
Evaluated by Micro Size Specimens
Ikuo Shohji, Tsutomo Osawa, Takashige Matsuki, Yoshiharu Kariya, Kiyokazu Yasuda and Tadashi Takemoto
Smart Processing Technology, Vol.2, pp.99-102 (2008)
- Estimation of Thermal Fatigue Resistance of Sn-Bi(-Ag) and Sn-Ag-Bi-Cu
Lead-Free Solders Using Strain
Rate Sensitivity Index
Kiyokazu Yasuda, Ikuo Shohji and Tadashi Takemoto
Materials Science Forum, Vol.580-582, pp.221-224 (2008)
- Effect of Specimen Size and Aging on Tensile Properties of Sn-Ag-Cu Lead-free
Solders
Ikuo Shohji, Tsutomu Osawa, Takashige Matsuki, Yoshiharu Kariya, Kiyokazu Yasuda and Tadashi Takemoto
Materials Transactions, Vol.49, No.5, pp.1175-1179 (2008)
- Thermal Fatigue Life Evaluation of Lead-Free Solder Joint of Chip Size
Package with Underfill
Tomotake Tohei, Ikuo Shohji, Keisuke Yoshizawa, Masaharu Nishimoto, Takayuki Kawano, Yumiko Mizutani and
Yoshihiko Ohsaki
J. Japan Inst. Metals，Vol.72, No.3, pp.244-248 (2008)
- Wear Properties of Electroless Ni-P Plated Al Alloy and Polyacetal
Ikuo Shohji, Susumu Arai, Junichi Uchikawa, Takanori Matsui and Eiji Kobayashi
Journal of The Surface Finishing Society of Japan, Vol.58, pp.846-850 (2007)
- Effect of P Particle Size on Brazability of Cu-P Composite Plating Film
Ikuo Shohji, Susumu Arai, Naoki Kano, Masahisa Uenishi and Noboru Otomo
Journal of The Surface Finishing Society of Japan, Vol.58, pp.831-835 (2007)
- Influence of Content of Ni and Ag on Microstructure and Joint Strength
of Sn-Ag-Cu-Ni-Ge Lead-Free
Solder Joint
Ikuo Shohji, Satoshi Tsunoda, Hirohiko Watanabe and Tatsuhiko Asai
Key Engineering Materials, Vol.353-358, pp.2033-2036 (2007)
- Effect of Properties of Underfill Materials on Thermal Stress Relief in
Lead-Free Solder Joint of Chip Size
Package
Ikuo Shohji, Keisuke Yoshizawa, Masaharu Nishimoto and Takayuki Kawano
Key Engineering Materials, Vol.353-358, pp.2029-2032 (2007)
- Development of Cu Brazing Sheet with Cu-P Composite Plating
Ikuo Shohji, Susumu Arai, Naoki Kano, Noboru Otomo and Masahisa Uenishi
Key Engineering Materials, Vol.353-358, pp.2025-2028 (2007)
- Printing Durability of Electroformed Ni-Co Alloy Mesh for Screen Printing
Ikuo Shohji，Yozo Murata，Ryoichi Yamamoto，Nobuo Sasaki and Kousei Todate
Journal of Japan Institute of Electronics Packaging，10, [6], pp.491-494 (2007) - Cu-P Composite Plating
Susumu Arai, Yosuke Suzuki, Masahiro Ikeda, Ikuo Shohji, Masahisa Uenishi and Noboru Otomo
Journal of The Surface Finishing Society of Japan, Vol.58, pp.139-141 (2007)
- An Evaluation of Low-Cycle Fatigue Property for Sn-3.5Ag and Sn-0.7Cu Lead-free
Solder Using Surface
Deformation
Takehiko Takahashi, Susumu Hioki, Ikuo Shohji and Osamu Kamiya
Key Enbineering Materials, Vol.326-328, pp.1035-1038 (2006)
- Low-Cycle Fatigue Life Definition for Sn-3.5Ag and Sn-0.7Cu Lead-free Solders
Using Surface
Deformation
Takehiko Takahashi, Susumu Hioki, Ikuo Shohji and Osamu Kamiya
Quarterly Journal of The Japan Welding Society, 24, No.3, pp.253-258 (2006)
- Thermal stress relief in lead-free solder joint for chip size package with
encapsulant materials
Ikuo Shohji, Keisuke Yosizawa, Masaharu Mishimoto and Takayuki Kawano
Smart Processing Technology, Vol.1, pp.175-178 (2006)
- Whisker-Free Pb-Free Solder through Alloying
Yoshito Hayashida, Yoshiyuki Takahashi, Takao Ono and Ikuo Shohji
J. Japan Inst. Metals，Vol.70, No.3, pp.220-225 (2006)
- Low cycle Fatigue behavior and Surface Feature by Image Processing of Sn-0.7Cu
Lead-free Solder
Takehiko Takahashi, Susumu Hioki, Ikuo Shohji and Osamu Kamiya
Key Engineering Materials, Vol.306-308, pp.115-120 (2006)
- Reliability of Solder Joint with Sn-Ag-Cu-Ni-Ge Lead-free Alloy under Heat
Exposure Conditions
Ikuo Shohji, Satoshi Tsunoda, Hirohiko Watanabe, Tatsuhiko Asai and Megumi Nagano
Materials Transactions, Vol.46, No.12, pp.2737-2744 (2005)
- Comaprison of Immersion Gold Plating in Reliability of a Lead-free Solder
Joint with Autocatalytic
Electroless Gold Plating
Kiyotomo Nakamura, Toshikazu Ookubo, Ikuo Shohji and Hiroki Goto
Materials Transactions, Vol.46, No.12, pp.2730-2736 (2005)
- Influence of an Immersion Gold Plating Layer on Reliability of a Lead-free
Solder Joint
Ikuo Shohji, Hiroki Goto, Kiyotomo Nakamura and Toshikazu Ookubo
Materials Transactions, Vol.46, No.12, pp.2725-2729 (2005)
- Fatigue Damage Evaluation by Surface Feature for Sn-3.5Ag and Sn-0.7Cu
solders
Takehiko Takahashi, Susumu Hioki, Ikuo Shohji and Osamu Kamiya
Materials Transactions, Vol.46, No.11, pp.2335-2343 (2005)
- Estimation of Thermal Fatigue resistances of Sn-Ag and Sn-Ag-Cu Lead-free
Solders using Strain Rate
Sensitivity Index
Ikuo Shohji, Kiyokazu Yasuda and Tadashi Takemoto
Materials Transactions, Vol.46, No.11, pp.2329-2334 (2005)
- Influence of Surface Finish of Cu Electrode on Shear Strength and Microstructure
of Solder Joint with
Sn-3Ag-0.5Cu
Ikuo Shohji, Hiroki Goto, Kiyotomo Nakamura and Toshikazu Ookubo
Key Engineering Materials, in printing, pp.2864-2869 (2005)
- High Speed Bonding of Resin Coated Cu Wire and Sn Electrode with Ultrasonic
Bonding for
High-Frequency Chip Coil
Ikuo Shohji, Tsukasa Sakurai and Shinji Arai
Key Engineering Materials, in printing, pp.2819-2824 (2005)
- Mechanical Properties and Microstructure of SUS304 Brazed Joint with Ni-Base
Filler Metals Added Cr
Powder
Ikuo Shohji, Satoshi Takayama, Takanori Nakazawa, Ken Matsumoto and Masanori Hikita
Key Engineering Materials, in printing, pp.2767-2771 (2005)
- Low Cucle Fatigue Properties and Surface Feature by an Image Processing
of Sn-0.7Cu Lead-free
Solder
Takehiko Takahashi, Susumu Hioki, Ikuo Shohji and Osamu Kamiya
Quarterly Journal of The Japan Welding Society, 23, No.3, pp.436-441 (2005)
- Ultrasonic Bonding of Resin-Coated Cu wire for High-Frequency Chip Coils
Ikuo Shohji, Shinji Arai, Tsukasa Sakurai, Hiroyuki KumeharaKeiji Usunami, Yoshitaka Kimura and Takashi Susai
Journal of Japan Institute of Electronics Packaging 7, [7], pp.622-628 (2004)
- Tensile Properties of Sn-0.7mass%Cu Lead-free
Ikuo Shohji, Tomohiro Yoshida, Takehiko Takahashi and Susumu Hioki
Transactions of Materials Research Society of Japan, Volume 29 - No.5, pp.2001-2004 (2004)
- Creep Properties of Sn-8mass%Zn-3mass%Bi Lead-free Alloy
Ikuo Shohji, Colin Gagg and William J. Plumbridge
Journal of Electronic Materials, Vol. 33, No.8, pp.923-927 (2004)
- Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free
Solder Balls
Ikuo Shohji, Yuji Shiratori, Hiroshi Yoshida, Masahiko Mizukami and Akira Ichida
Materials Transactions, Vol.45, No.3,pp.754-758 (2004)
- Joint Strength and Microstructure of SUS304 Brazed with Nickel-base Filler
Metal for Heat Exchangers
Satoshi Takayama，Youhei Arikura，Ikuo Shohji，Takanori Nakazawa，Ken Matsumoto and Masanori Hikita
J. Japan Inst. Metals，Vol. 68，No.2，pp.130-133 (2004)
- Comparison of Low-melting Lead-free Alloys in Tensile Properties with Sn-Pb
Eutectic Solder
Ikuo Shohji, Tomohiro Yoshida, Takehiko Takahashi and Susumu Hioki
Journal of Materials Science: Materials in Electronics, 15-4, pp.219-223 (2004)
- Solder Joint Reliability Evaluation of Chip Scale Package by Modified Coffin-Manson
Equation
Ikuo Shohji, Hideo Mori and Yasumitsu Orii
Microelectronics Reliability, 44, pp.269-274 (2004)
- Influence of the Diameter of Solder Powder in Solder Paste on the Applied
Solder Volume by Paste
Printing
Ikuo Shohji, Yuji Shiratori and Makoto Miyazaki
Journal of Japan Institute of Electronics Packaging, 7,[1], pp.62-66 (2004)
- Tensile Properties of Sn-Ag Based Lead-free Solders and Strain Rate Sensitivity
Ikuo Shohji, Tomohiro Yoshida, Takehiko Takahashi and Susumu Hioki
Materials Science and Engineering A, Vol. 366-1, pp.50-55 (2004)
- Microstructures and Mechanical Properties of Mo Heater Chip Brazed with
Au-18mass%Ni
Ikuo Shohji, Yoshinori Kawabata and Yoshitaka Kimura
Materials Transactions, Vol.44, No.5, pp.866-869 (2003)
- Microstructures and Mechanical Properties of SUS316 Steel Brazed with Cu-7mass%P
Filler
Shohji Ikuo, Fujihira Mitsuhiro, Ogane Akira, Nakazawa Takanori, Uenishi Masahisa and Otomo Noboru
Quarterly Journal of The Japan Welding Society, 20, No.４，pp.517-522 (2002)
- Tensile Properties of Sn-3.5Ag and Sn-3.5Ag-0.75Cu Lead-Free Solders
Ikuo Shohji, Tomohiro Yoshida, Takehiko Takahashi and Susumu Hioki
Materials Transactions, Vol.43, No.8, pp.1854-1857 (2002)
- Interface Reaction and Mechanical Properties of Lead-Free Sn-Zn Alloy/Cu
Joints
Ikuo Shohji, Takao Nakamura, Fuminari Mori and Shinichi Fujiuchi
Materials Transactions, Vol.43, No.8, pp.1797-1801 (2002) - Effect of Cu Cored Ball in Solder Ball on Microstructure and Strength of
BGA Joint Using Electroless
Plated Ni/Au Pad
Toshio Saeki, Shinya Kiyono, Keisuke Uenishi, Kojiro F. Kobayashi, Ikuo Shohji and Masaharu Yamamoto
Journal of Japan Institute of Electronics Packaging, 4,[4], pp.306-311 (2001)
- Rupture Life of CSP Solder Joints with Sn-Ag Lead-Free Solders under Thermal
Cycle Condition
Ikuo Shohji, Fuminari Mori, Shinichi Fujiuchi, Masaru Yamashita
Journal of Japan Institute of Electronics Packaging, 4,[4], pp.289-292 (2001)
- Thermal Fatigue Behavior of Flip-chip Joints with Lead-free Solders
Ikuo Shohji, Fuminari Mori and Kojiro F. Kobayashi
Materials Transactions, Vol.42, No.5,pp.790-793 (2001)
- Effect of Cu in Pb Free Solder Ball on the Microstructure of BGA Joints
with Au/Ni Coated Cu Pads
Keisuke Uenishi, Toshio Saeki, Yasuhiro Kohara, Kojiro F. Kobayashi, Ikuo Shohji, Masataka Nishiura and Masaharu Yamamoto
Materials Transactions, Vol.42, No.5,pp.756-760 (2001)
- The Microstructure and Shear Strength of the BGA Joint Using Cu Cored Sn-3.5Ag
Solder
Yasuhiro Kohara, Toshio Saeki, Keisuke Uenishi, Kojiro F. Kobayashi, Ikuo Shohji and Masaharu Yamamoto
Journal of Japan Institute of Electronics Packaging, 4,[3], pp.192-199 (2001)
- Evaluation of the Microstructures of CSP Microjoints with Sn-Ag Lead-Free
Solders
Ikuo Shohji, Fuminari Mori, Shinichi Fujiuchi and Masaru Yamashita
Journal of Japan Institute of Electronics Packaging, 4,[2], pp.133-137 (2001)
- Development of Flip Chip Rework Method for High Dense Printed Circuit Board
Fuminari Mori, Kazushige Toriyama, Naoki Katsu and Ikuo Shohji
Journal of Japan Institute of Electronics Packaging, 3,[4], pp.335-338 (2000)
- Effect of Cu Cored Ball in Solder Ball on Microstructure and Strength of
BGA Joint
Shinya Kiyono, Keisuke Uenishi, Kojiro F. Kobayashi, Ikuo Shohji and Masaharu Yamamoto
Journal of Japan Institute of Electronics Packaging, 2,[4], pp.298-302 (1999)
- Growth Kinetics of Intermetallic Compounds on the Boundary between Au and
In-Sn Alloys
Ikuo Shohji, Shinichi Fujiwara, Shinya Kiyono, Toshio Fujii and Kojiro F. Kobayashi
Journal of Japan Institute of Electronics Packaging, 2,[2], pp.121-126 (1999)
- Intermetallic Compound Layer Formation Between Au and In-48Sn Solder
I.Shohji, S.Fujiwara, S.Kiyono and K.F.Kobayashi
Scripta Materialia, Vol.40, No.7, pp.815-820 (1999)
- Microstructure and Thermal Fatigue Behavior of Flip Chip Joint by Gold
Bump
Ikuo Shohji, Yasumitsu Orii and Kojiro F. Kobayashi
Quarterly Journal of The Japan Welding Society, 16, No.2, pp.215-222 (1998)
- Shear Property of Solders for Flip Chip Joining
Ikuo Shohji, Yasumitsu Orii and Kojiro F. Kobayashi
Quarterly Journal of The Japan Welding Society, 16, No.1, pp.51-58 (1998)
- Growth Kinetics of Intermetallic Compounds on the Boundary between Au and
In-48Sn Solder
Ikuo Shohji, Shinichi Fujiwara, Shinya Kiyono and Kojiro F. Kobayashi
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits, 13,[1], pp.24-29 (1998)
- Flip Chip Attach Technology for Fine Pitch Connection by In Alloy Solder
Ikuo Shohji, Takeshi Yamada, Hideo Kimura, Shinichi Fujiuchi and Yasumitsu Orii
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits, 12,[1], pp.25-28 (1997)
List of Papers
List of Ikuo Shohji's Papers