Present Works
- Research into Mechanical Properties of Lead-free Solders
- Interface Reaction of Electrode and Lead-free Solder
- Thermal Fatigue Behaviors of Micro Joints with Micro Solder Balls
- Impact Reliability of Micro Joints with Micro Solder Balls
- Development of High Reliability Lead-free Solder
- Development of New Resin Material for Electronics Packaging
- Erosion of Stainless Steel by Molten Lead-free Solder
- Development of Joining for Thermal Exchanger System
- Research into Mechanical Properties of Mg Alloys