投稿論文
- An Evaluation of the Wear Resistance of Electroplated Nickel Coatings Composited
with 2,2,6,6-tetramethylpiperidine 1-oxyl-Oxidized Cellulose Nanofibers
Makoto Iioka, Wataru Kawanabe, Subaru Tsujimura, Tatsuya Kobayashi, Ikuo
Shohji
Polymers 2024, 16(2), 224,pp.1-21 (2024)
【DOI：https://doi.org/10.3390/polym16020224】
- Application of Metal Sputtering Treatment to Cellulose Materials Used as
Co-Deposited Material
for Electrolytic Nickel Composite Plating
飯岡諒, 川鍋渉, 小林竜也, 荘司郁夫
溶接学会論文集, 第41巻, 第4号, pp.337-347 (2023)
【DOI : https://doi.org/10.2207/qjjws.41.337】
- Investigation of Deposition Conditions and Basic Properties of CNF Composite
Ni Plated Film by
Electroless Plating Method
Wataru Kawanabe, Makoto Iioka, Tatsuya Kobayashi, Ikuo Shohji
Materials Science Forum, Vol.1106, pp.69-74 (2023)
【DOI : https://doi.org/10.4028/p-P8lGXG】
- Effect of Special Plating Films on Galvanic Corrosion Behavior between
Metal and CFRTP
Tatsuya Kobayashi, Kei Shimizu, Ikuo Shohji
Materials Science Forum, Vol.1106, pp.63-68 (2023)
【DOI : https://doi.org/10.4028/p-BGa78M】
- Investigation of Effects of Electroplating Conditions on TEMPO-Oxidized
Cellulose Nanofiber
Composited Nickel Electroplated Films
Makoto Iioka, Wataru Kawanabe, Tatsuya Kobayashi, Ikuo Shohji
Materials Science Forum, Vol.1106, pp.55-62 (2023)
【DOI: https://doi.org/10.4028/p-NlB9Zf】
- Effect of High Temperature and Humidity on Bond Strength of Al/Resin Adhesive
Joints
Itsuki Watanabe, Tatsuya Kobayashi, Ikuo Shohji
Key Engineering Materials, Vol.967, pp.63-68 (2023)
【DOI : https://doi.org/10.4028/p-XZXg5O】
- Effect of Sb Addition on Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu
Solder Ball Joints
Marina Oyama, Tatsuya Kobayashi, Ikuo Shohji, Mohd Arif Anuar Mohd Salleh
Key Engineering Materials, Vol.967, pp.43-49 (2023)
【DOI : https://doi.org/10.4028/p-AxJR0d】
- Fabrication of High-Temperature Solder by Zn Plating Films Containing Al
Particles
Tatsuya Kobayashi, Yuki Abiko, Ikuo Shohji
Key Engineering Materials, Vol.967, pp.37-42 (2023)
【DOI : https://doi.org/10.4028/p-CzY5ta】
- Effect of Plating Potential on Three-Dimensional Structural Plating Films
and their Adhesion to
Epoxy Resin
Tatsuya Kobayashi, Thai Anh Pham, Ikuo Shohji
Key Engineering Materials, Vol.966, pp.31-36 (2023)
【DOI：https://doi.org/10.4028/p-4q5TMh】
- Microstructure and Mechanical Properties of A6061/GA980 Resistance Spot
Weld
Toshiki Nonomura, Tsuyoshi Kosaka, Tatsuya Kobayashi, Ikuo Shohji, Muneyoshi
Iyota
Key Engineering Materials, Vol.966, pp.25-30 (2023)
【DOI : https://doi.org/10.4028/p-rUe1Zd】
- Fabrication of Electroplated Nickel Composite Films Using Cellulose Nanofibers
Introducedwith Carboxy
Groups as Co-Deposited Materials
Makoto Iioka, Wataru Kawanabe, Tatsuya Kobayashi, Ikuo Shohji and Kota
Sakamoto
Surfaces, Vol.6, Vol.2, pp.164-178 (2023)
【DOI：https://doi.org/10.3390/surfaces6020012】
- Sn-Sb-Ag 系高温鉛フリーはんだの疲労特性に及ぼす添加元素の影響
三ツ井恒平, 山本瑞貴, 川井健太郎, 小林竜也, 荘司郁夫, 渡邉裕彦
エレクトロニクス実装学会誌, Vol.26, No.3, pp.266-274 (2023)
【DOI: https://doi.org/10.5104/jiep.JIEP-D-22-00081】
- Sn-Sb-Ag 系はんだダイボンド接合部のパワーサイクル損傷挙動に及ぼす添加元素の影響
山中佑太, 荘司郁夫, 小林竜也, 三ツ井恒平, 渡邉裕彦
スマートプロセス学会誌, Vol.11, No.5, pp.194-201 (2022)
- 半導体パッケージ検査用プローブ材と Sn-58Bi はんだ界面における反応層成長過程
渡會和己, 荘司郁夫, 小林竜也, 星野智久, 佐藤賢一, 小林俊介, 小谷直仁
スマートプロセス学会誌, Vol.11, No.5, pp.188-193 (2022)
- An Experimental Study of Fabrication of Cellulose Nano-Fiber Composited
Ni Film by Electroplating
Makoto Iioka, Wataru Kawanabe, Ikuo Shohji and Tatsuya Kobayashi
Materials Transactions, Vol.63, No.6, pp.821-828 (2022)
【DOI:10.2320/matertrans.MT-MC2022012】
- Formation of CuNi Alloy Plating Film for Improving Adhesion between Metal
and Resin
Tatsuya Kobayashi, Akifumi Kubo and Ikuo Shohji
Materials Transactions, Vol.63, No.6, pp.800-804 (2022)
【DOI:10.2320/matertrans.MT-MC2022002】
- Investigation of Mechanical Properties of High Tg Epoxy Resin Material
Xinya ZHAO, Hironao MITSUGI, Ikuo SHOHJI and Tatsuya KOBAYASHI
スマートプロセス学会誌, Vol.10, No.6, pp.365-371 (2021)
- 電子実装用エポキシ樹脂および Ni/ 樹脂接着部の吸水劣化挙動
三ツ木寛尚, 鈴木陸, 荘司郁夫, 小林竜也
スマートプロセス学会誌, Vol.10, No.6, pp.359-364 (2021)
- Mechanistic Study of Ni–Cr–P Alloy Electrodeposition and Characterization
of Deposits
Shubin Liu, Ikuo Shohji, Tatsuya Kobayashi, Junichiro Hirohashi, Tsunehito
Wake,Hiroki Yamamoto, Yuichiro Kamakoshi
Journal of Electroanalytical Chemistry, 897, 115582 (2021)
【DOI: https://doi.org/10.1016/j.jelechem.2021.115582】
- Low Cycle Fatigue Characteristics of Oxygen-Free Copper for Electric Power
Equipment
Takuma Tanaka, Togo Sugioka, Tatsuya Kobayashi, Ikuo Shohji, Yuya Shimada,
Hiromitsu Watanabe and
Yuichiro Kamakoshi
Materials, 14, 4237 (2021)
【DOI:https://doi.org/10.3390/ma14154237】
- Microstructure and Properties of SUS304 Stainless Steel Joints Brazed with
Electrodeposited
Ni-Cr-P Alloy Coating
Shubin Liu, Ikuo Shohji, Tatsuya Kobayashi, Katsuharu Osanai, Tetsuya Ando,
Junichiro Hirohashi, Tsunehito Wake,
Katsufumi Inoue and Hiroki Yamamoto
Materials, 14, 4216 (2021)
【DOI: https://doi.org/10.3390/ma14154216】
- Microstructure and Fatigue Behaviors of Dissimilar A6061/Galvannealed Steel
Joints Fabricated
by Friction Stir Spot Welding
Koki Kumamoto, Tsuyoshi Kosaka, Tatsuya Kobayashi, Ikuo Shohji, Yuichiro
Kamakoshi
Materials, 14, 3877 (2021)
【DOI:https://doi.org/10.3390/ma1414387】
- Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties
of Sn-Sb-Ag
Lead-Free Solder
Mizuki Yamamoto, Ikuo Shohji, Tatsuya Kobayashi, Kohei Mitsui, Hirohiko
Watanabe
Materials, 14, 3799 (2021)
【DOI:https://doi.org/10.3390/ma14143799】
- Recent Development of Joining and Conductive Materials for Electronic Components
Tatsuya Kobayashi, Tetsuya Ando
Materials Transactions (2021)
【DOI:https://doi.org/10.2320/matertrans.MT-M2021060】
- Joining process of dissimilar materials using three-dimensional electrodeposited
Ni-Cu film
T. Kobayashi, I. Shohji
Materials and Manufacturing Processes (2021)
【DOI:10.1080/10426914.2021.1885708】
- Investigation of Bonding Strength of Al Solid Phase Diffusion Bonded Joint
with Surface
Treatment Using Electrolyzed Water
Takuma Tanaka, Ikuo Shohji, Tatsuya Kobayashi, Hisashi Imai
Materials Science Forum, Vol. 1016, pp. 1466-1472 (2021)
- Effect of Temperature and Humidity on Degradation Behavior of Cu/Epoxy
Interface under
High Temperature and High Humidity Aging
Riku Suzuki, Ikuo Shohji, Tatsuya Kobayashi, Yu Tonozuka
Materials Science Forum, Vol. 1016, pp. 1436-1442 (2021)
- Effect of Microstructure on Joint Strength of Fe/Al Resistance Spot Welding
for Multi-Material
Components
Koki Kumamoto, Ikuo Shohji, Tatsuya Kobayashi, Muneyoshi Iyota
Materials Science Forum, Vol. 1016, pp. 774-779 (2021)
- Fabrication of three-dimensional microstructure film by Ni-Cu alloy electrodeposition
for
joining dissimilar materials
Tatsuya Kobayashi, Ikuo Shohji
Materials Science Forum, Vol. 1016, pp. 738-743 (2021)
- Brazing of Stainless Steel Using Electrolytic Ni-P Plating Film and Investigation
of CorrosionBehavior
Anna Hashimoto, Shubin Liu, Ikuo Shohji, Tatsuya Kobayashi, Junichiro Hirohashi,
Tsunehito Wake, Susumu Arai, Yuichiro Kamakoshi
Materials Science Forum, Vol. 1016, pp. 522-527 (2021)
- Sn-Sb-Ag系高温鉛フリーはんだ合金の機械的性質に及ぼす微量Ni及びGe添加の影響
三ツ井恒平, 荘司郁夫, 小林竜也, 渡邉裕彦
スマートプロセス学会誌, Vol.9, No.3, pp.133-139 (2020)
- ステンレス鋼製熱交換器用Niろうの腐食挙動
深井祐佑, 荘司郁夫, 小林竜也, 安藤哲也, 吉田拓也, 柏瀬毅, 大友昇
スマートプロセス学会誌, Vol.9, No.3, pp.127-132 (2020)
- 接着継手の高温高湿環境下における樹脂材凝集力および接着界面の劣化挙動調査
安孫子瞳, 荘司郁夫, 小林竜也, 冨田雄吾, 松永達則
スマートプロセス学会誌, Vol.9, No.2, pp.75-81 (2020)
- Evaluation of Microstructures and Mechanical Properties of Sn-10Sb-Ni Lead-Free
Solder Alloys with
Small Amount of Ni Using Miniature Size Specimens
Tatsuya Kobayashi, Ikuo Shohji
Metals 2019, Volume 9, Issue 12, 1348 (2019)
- Effects of Ni Addition to Sn-5Sb High-Temperature Lead-Free Solder on Its
Microstructure and
Mechanical Properties
Tatsuya Kobayashi, Kohei Mitsui and Ikuo Shohji
Materials Transactions, Vol.60, No.6, pp.888-894 (2019)
- Tensile and Fatigue Properties of Miniature Size Specimen of Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge
Lead-Free Solder
Masaki Yokoi, Tatsuya Kobayashi and Ikuo Shohji
Materials Science Forum, Vol. 941, pp.2081-2086 (2018)
- Effect of Cooling Rate on Intermetallic Compounds Formation in Sn-Ag-Cu-In
Solder
Kenji Miki, Tatsuya Kobayashi, Ikuo Shohji and Yusuke Nakata
Materials Science Forum, Vol. 941, pp.2075-2080 (2018)
- Investigation of Crack Initiation in Glass Substrate by Residual Stress
Analysis
Amon Shinohara, Tatsuya Kobayashi, Ikuo Shohji and Yuki Umemura
Materials Science Forum, Vol. 941, pp.2069-2074 (2018)
- Plastic Deformation Simulation of Sintered Ferrous Material in Cold-Forging
Process
Yuki Morokuma, Shinichi Nishida, Yuichiro Kamakoshi, Koshi Kanbe, Tatsuya
Kobayashi and Ikuo Shohji
Materials Science Forum, Vol. 941, pp.552-557 (2018)
- Microstructures and Mechanical Properties of Welded Joints of Several High
Tensile Strength Steel
Takahiro Izumi, Tatsuya Kobayashi, Ikuo Shohji and Hiroaki Miyanaga
Materials Science Forum, Vol. 941, pp.224-229 (2018)
- 高温高湿環境下における銅／エポキシ樹脂界面の劣化寿命評価
戸野塚悠, 小林竜也, 荘司郁夫, 外薗洋昭, 高橋邦明, 江連徳
スマートプロセス学会誌, Vol.7, No.4, pp.128-134 (2018）
- Comparison of Sn-5Sb and Sn-10Sb Alloys in Tensile and Fatigue Properties
Using Miniature Size
Specimens
Tatsuya Kobayashi, Kyosuke Kobayashi, Kohei Mitsui, and Ikuo Shohji
Advances in Materials Science and Engineering, Volume 2018, Article ID
1416942 (2018)
- Effect of Power Cycling and Heat Aging on Reliability and IMC Growth of
Sn-5Sb and Sn-10Sb Solder
Joints
Tatsuya Kobayashi, Ikuo Shohji, and Yusuke Nakata
Advances in Materials Science and Engineering, Volume 2018, Article ID
4829508 (2018)
- Comparison of Sn-Sb and Sn-Ag-Cu-Ni-Ge Alloys Using Tensile Properties
of Miniature Size Specimens
Tatsuya Kobayashi, Masaki Yokoi, Kyosuke Kobayashi, Kohei Mitsui, and Ikuo
Shohji
Solid State Phenomena, Vol. 273, pp.83-90 (2018)
- Sn-3Ag-0.5Cu はんだと W 基板上めっきメタライズ界面に生成する Sn-W 構造
依田智子, 原田正英, 西川徹, 小林竜也, 荘司郁夫
スマートプロセス学会誌, Vol. 3, No. 4, pp.232-239 (2014)
- Effect of Interfacial Reaction on Joint Strength of Semiconductor Metallization
and Sn-3Ag-0.5Cu
Solder Ball
Chiko Yorita, Tatsuya Kobayashi and Ikuo Shohji
Key Engineering Materials, 462-463, pp.849-854 (2011)
- Analysis of Stress-strain Hysteresis Loop and Prediction of Thermal Fatigue
Life for Chip Size Package
Solder Joints
Ikuo Shohji, Tatsuya Kobayashi and Tomotake Tohei
Key Engineering Materials, 462-463, pp.76-81 (2011)